First job was to answer a question about the melting temperature of a tin-zinc alloy so dug out this publication, well worth the 2/6 we paid for it.
Just a tad below 200C, done.
Then some emails and some tinkering with Powerpoint, then down to the applications area to test some solder pastes.
Printed the paste onto some circuit boards with an automatic printer:
I had a few to evaluate so just a short print run of ten boards, plus a few extras which were going to be assembled to check the soldering quality.
The majority of electronic assemblies are currently made this way, the solder is printed onto the board using a stencil in the form of a paste, it's about 50% by volume solder powder, the other half is flux.
Then I measured the volume of the solder deposits using a Koh Young SPI (Solder Paste Inspection) system, this does the measurements automatically, I exported the data to sort out later in the week.
I placed components onto a few of the pasted boards using a pick & place robot.
Some chip resistors, some QFPs, nothing too challenging today- just a quick evaluation to check a new manufacturing process.
Then it was time to break out the soldering iron (all the soldering is done in a single step in a big oven)
Afterwards I photographed some of the joints, cleaned the post-soldering (flux) residues off using a big dishwasher. Tomorrow I'll finish it off and write it up if there aren't too many interruptions.